A spin cleaning apparatus is provided to prevent a wafer from being contaminated again by a cleaning solution by preventing the cleaning solution from remaining on the inner circumferential surface of a housing. A process is performed in a housing(100). A wafer is supported by a support plate positioned in the housing. The support plate is rotated by a driving axis connected to the lower part of the support plate. A groove(180) is formed in a spin cleaning apparatus, functioning as a path for downward guiding the cleaning solution attached to the inner circumferential surface of the housing. The groove can be tilted downward along the rotation direction of the driving axis.
