发明名称 TREATING LIQUID SUPPLY MEMBER AND SEMICONDUCTOR MANUFACTURING APPARATUS WITH IT
摘要 <p>A process solution supply apparatus and semiconductor manufacturing equipment with the same are provided to prevent the generation of process failure due to the process solution and constant temperature water leaked from a process solution supply line and a constant temperature water supply unit. A process solution supply apparatus includes a process solution supply member(130) with a nozzle capable of supplying a process solution to a semiconductor substrate, a constant temperature water supply member, and a support unit. The constant temperature water supply member includes a supply line(142) for supplying a constant temperature water from a constant temperature water supply source to the process solution supply member and a collection line(144) for collecting the constant temperature water after controlling the temperature of the process solution. The support unit(150) is installed at a connection portion between the supply line, the collection line and the nozzle. The support unit includes a predetermined space capable of storing leaked process solution and constant temperature water.</p>
申请公布号 KR20070080520(A) 申请公布日期 2007.08.10
申请号 KR20060011885 申请日期 2006.02.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, BONG KIL;GO, DAE HO
分类号 H01L21/02;H01L21/027 主分类号 H01L21/02
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