| 摘要 |
<p>A photoresist coating apparatus and a method are provided to enhance efficiency of a photoresist coating process on a wafer, to check the thickness of coated photoresist layer and to detect the generation of failure during the photoresist coating process in real time. A photoresist coating apparatus includes a process module for performing a photoresist coating process on a wafer, a wafer transfer unit for transferring the wafer to/from the process module, a measurement member, and a control unit. The measurement member(120) is used for measuring the thickness of a photoresist layer coated on the wafer. The control unit(130) is used for receiving the thickness data from the measurement member and controlling the wafer transfer unit on the basis of the thickness data.</p> |
