| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a surface-mounting module which can eliminate the need for a cleaning step, solder a mounting electronic component according to its property, and have a high mounting density of such electronic components, and to provide a method of manufacturing the module. <P>SOLUTION: (a) A solder pattern 3 is formed on the upper surface of a wiring substrate 1, (b) a first electronic component 4 is located on the upper surface of the solder pattern 3, (c) the wiring substrate 1 having the first electronic component 4 located thereon is subjected to reflow treatment to solder the first electronic component, (d) a solder foil 11 is mounted at such a position that a shortest distance (w) from the mounted position of the first electronic component 4 becomes 1 to 10 mm with the wiring substrate 1 having the first electronic component 4 mounted thereon without cleaning, (e) a second electronic component 5 is mounted on the upper surface of the solder foil 11, (f) the solder foil 11 is heated by infrared radiation or laser radiation to melt the solder foil 11 and to solder the second electronic component 5 and the wiring substrate 1, thus mounting the second electronic component 5. In this manner, a surface mounting module is manufactured. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
