| 摘要 |
PROBLEM TO BE SOLVED: To provide a head device capable of ensuring adhesive strength between an element holder and a device frame even if the device frame is made compact and thin without causing the deterioration of workability. SOLUTION: In through holes 459, an opened area S2 formed on a front side is larger than an opened area S1 formed on a rear side where a pair of projections 456 and 457 are projected, and in a Z direction, an introduction part 459a cylindrically formed from the rear side of a fixing plate 451 to the front side and a mortar part 459b expanding from the end of the introduction part 459a toward the front are arranged side by side in this order. Since the introduction part 459a is formed cylindrically and any of cross sections perpendicular to the Z direction is S1, the amount of an adhesive applied inside can be suppressed. On the other hand, the mortar part 459b is formed in a shape of mortar which expands toward the front from the end of the introduction part 459a, the adhesion area of the front side of an element holder 45 can be made large to improve the adhesive strength with the device frame 2. COPYRIGHT: (C)2007,JPO&INPIT
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