| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composite copper foil for which a copper foil having an extremely fine unevenness on the copper foil surface can be applied, and which is excellent in bonding force, to provide a manufacturing method for the resin composite copper foil, to provide a copper-clad laminate using the resin composite copper foil which has a good heat resistance and moisture absorbency heat resistance, and to provide a print wiring board. SOLUTION: For this resin composite copper foil, on one surface of a copper foil, a resin layer containing a block copolymerized polyimide and a maleimide compound is formed. The manufacturing method for the resin composite copper foil, the copper-clad laminate using the resin composite copper foil, and the print wiring plate using the copper-clad laminate are provided. COPYRIGHT: (C)2007,JPO&INPIT |
