Component mounting method and component mounting apparatus

摘要

A method and an apparatus for mounting electronic components that enables precise mounting of electronic components, such as deformation-prone thin IC chips or fine-pitch and high-pin-count IC chips, on a substrate. Thin IC chips, which conventionally tend to lose flatness because of warping that occurs during production or deformation that occurs when picked up with a suction nozzle, are pressed against a substrate ( 4 ) with a preset load using a suction nozzle with a flat suction surface ( 11 b) so as to correct deformation; the suction nozzle ( 11 ) is controlled to move up to make up for a decrease in the distance between the oppositely spaced IC chip and the substrate ( 4 ) that is caused by thermal expansion due to the heating for melting solder bumps ( 1 a) on the electrodes; and the suction nozzle ( 11 ) is controlled to move down to mitigate the effect of a pulling-apart force applied to the molten parts as the thermally expanded parts cool down and contract.