发明名称 |
Electrolytic processing apparatus and substrate processing apparatus and method |
摘要 |
The present invention replaces all or a portion of substrate processing by chemical-mechanical polishing with electrolytic processing using deionized water, ultrapure water or the like. An electrolytic processing apparatus comprises: a chemical-mechanical polishing section for chemically-mechanically polishing a surface of a substrate; an electrolytic processing section having a processing electrode and a feeding electrode, and also having an ion exchanger provided at least either between the substrate and the processing electrode or between the substrate and the feeding electrode, for electrolytically processing a surface of a workpiece under existence of a solution by applying a voltage between the processing electrode and the feeding electrode; and a top ring capable of freely moving between the chemical-mechanical polishing section and the processing electrode section.
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申请公布号 |
US2007181432(A1) |
申请公布日期 |
2007.08.09 |
申请号 |
US20070723934 |
申请日期 |
2007.03.22 |
申请人 |
SHIRAKASHI MITSUHIKO;KUMEKAWA MASAYUKI;YASUDA HOZUMI;KOBATA ITSUKI;NOJI IKUTARO;YOSHIDA KAORI |
发明人 |
SHIRAKASHI MITSUHIKO;KUMEKAWA MASAYUKI;YASUDA HOZUMI;KOBATA ITSUKI;NOJI IKUTARO;YOSHIDA KAORI |
分类号 |
C25D5/10;B23H3/00;B23H3/04;B23H3/08;B23H5/08;B24B37/04;C25F3/00;C25F5/00;C25F7/00;H01L21/321 |
主分类号 |
C25D5/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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