| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma cleaning method which suppresses a sputtering of an organic layer provided on a substrate to be treated, and enables an effective removal of organic materials from a conductive part. SOLUTION: When an irradiation of plasma 28 is carried out to a wiring 19 of a printed-wiring substrate 17 to clean, a plasma concentrated processing is applied to the printed-wiring substrate 17 such that the plasma concentrate on the wiring 19 to be cleaned to generate the plasma 18 on an area fronting on the wiring 19, and the generated plasma 18 is irradiated on the wiring 19. For example, the printed-wiring substrate 17 is mounted on a lower electrode 16 to short-circuit the lower electrode 16 and the wiring 19 through a through hole 21, and a voltage is applied between an upper electrode 15 and the lower electrode 16 to generate the plasma 18. Thereby, an electrical potential having a reverse polarity to the irradiating plasma 18 is given to the wiring 19, and the plasma 18 can be irradiated on the wiring 19 and its circumference in a concentrated manner. COPYRIGHT: (C)2007,JPO&INPIT
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