发明名称 High voltage semiconductor devices and methods for fabricating the same
摘要 High voltage semiconductor devices and methods for fabricating the same are provided. An exemplary embodiment of a semiconductor device capable of high-voltage operation, comprising a substrate comprising a first well formed therein. A gate stack is formed overlying the substrate, comprising a gate dielectric layer and a gate electrode formed thereon. A channel well and a second well are formed in portions of the first well. A source region is formed in a portion of the channel well. A drain region is formed in a portion of the second well, wherein the gate dielectric layer comprises a relatively thinner portion at one end of the gate stack adjacent to the source region and a relatively thicker portion at one end of the gate stack adjacent to and directly contacts the drain region.
申请公布号 US2007181941(A1) 申请公布日期 2007.08.09
申请号 US20060351154 申请日期 2006.02.09
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 LIN YI-CHUN;WU KUO-MING;LIU RUEY-HSIN
分类号 H01L29/76;H01L21/336 主分类号 H01L29/76
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