发明名称 Processing-fluid flow measuring method
摘要 An object to be processed such as a semiconductor wafer is processed by supplying a process fluid such as an ozone gas and a water vapor into a process vessel from a supply source through a supply pipe. During the process, a temperature of the process fluid flowing through the supply pipe is detected. By previously measuring and recording a relationship between a temperature of the process fluid and a flow rate of the process fluid, for example, a flow rate of the process fluid can be determined based on the detected temperature of the process fluid.
申请公布号 US2007181147(A1) 申请公布日期 2007.08.09
申请号 US20060493038 申请日期 2006.07.26
申请人 SATAKE KEIGO 发明人 SATAKE KEIGO
分类号 B08B6/00;B08B3/00;B08B7/04 主分类号 B08B6/00
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