发明名称 PLASMA TREATMENT METHOD AND PLASMA APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a method which certainly fixes a member to be treated (substrate) on a tray in plasma treatment and before/after it to elevate treatability and operativity, and can easily strip the substrate from the tray when necessary; and to provide its apparatus. <P>SOLUTION: The plasma treatment method, which mounts the substrate positioned on the tray on a supporting bed to treat the surface of the substrate by plasma, bonds the substrate to the tray with a heat-strippable adhesive member. A foam strippable sheet can be preferably used as a heat-strippable adhesive member. As the heat strippable adhesive member usually has adhesion, the tray and the substrate are exactly fixed before/after plasma, and a good operativity can be obtained, moreover, after treatment, the substrate is easily stripped from the tray only heating the tray higher than a predetermined stripping temperature. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007201404(A) 申请公布日期 2007.08.09
申请号 JP20060196558 申请日期 2006.07.19
申请人 SAMCO INC 发明人 NISHINOMIYA TOMOYASU;OGIYA HIROMICHI;HIRAMOTO MICHIHIRO
分类号 H01L21/3065;C23C16/458;H01L21/683;H05H1/46 主分类号 H01L21/3065
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