| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin compound which does not react at low temperature or at ordinary temperature, when stored, has excellent storage stability, causes a cross-linking reaction to accelerate the curing of a resin, when heated, thus giving a cured film having good film hardness, excellent chemical resistance, excellent heat resistance, excellent dielectric characteristics, excellent electric insulating property, and the like, to provide a thermosetting resin composition, and to provide a photosensitive composition. <P>SOLUTION: This epoxy resin composition having two or more oxirane rings each having a substituent at an oxirane ring site, in one molecule. The thermosetting resin composition and the photosensitive composition each using the epoxy resin composition. <P>COPYRIGHT: (C)2007,JPO&INPIT |
