发明名称 MANUFACTURING METHOD OF ACOUSTIC WAVE ELEMENT, MANUFACTURING METHOD OF ELECTRONIC DEVICE, MASK AND MANUFACTURING METHOD OF MASK
摘要 <P>PROBLEM TO BE SOLVED: To improve property of an acoustic wave element, and improve an yield ratio of the acoustic wave element. <P>SOLUTION: A piezo-electric film 13 is formed on a substrate 10, a conductive film 17 is formed on the piezo-electric film 13. After a conductive film 19b which positions on the conductive film 17, and is electrically connected to a comb teeth type electrode 19a, is formed further, while the comb teeth type electrode 19a for generation of the elastic wave is formed on the piezo-electric film 13, a protection film 21 which covers the comb teeth type electrode 19a, and has an opening part OA2, is formed on the conductive film 19b. As a result, connection failures are reduced because it is possible to pass through at a time of wire bonding even if etching residue remains at a bottom of the opening part OA2 at a time of forming the opening part OA2, i.e., etching of the protection film 21. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007201772(A) 申请公布日期 2007.08.09
申请号 JP20060017339 申请日期 2006.01.26
申请人 SEIKO EPSON CORP 发明人 KONO HIDEYASU;KANAZAWA EISUKE;FUJII SATORU
分类号 H03H3/08;H01L41/09;H01L41/18;H01L41/187;H01L41/22;H01L41/23;H01L41/253;H01L41/29;H03H9/25 主分类号 H03H3/08
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