发明名称 LIGHT-EMITTING MODULE, AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a light-emitting module having excellent processability by employing a lead frame principally containing copper, an insulator made of a resin composition, an optically reflective material and a metal plate instead of a ceramic substrate, and to provide a manufacturing method thereof. <P>SOLUTION: In the light-emitting module, one part of a lead frame 100 in which a ring-like convex portion 114 is formed on one part is covered with the optically reflective material 104, a light-emitting element 108 is mounted, and the lead frame 100 principally containing copper is molded integrally with the metal plate 112 via a thermally conductive resin 102. With this configuration, a light to be emitted from a light-emitting element 108 is reflected forward by the optically reflective material 104 and a reflection section 116, and heat generated from the light-emitting element 108 is transmitted from the lead frame 100 to the metal plate 112 via the thermally conductive resin 102. Thus, the light-emitting efficiency and heat radiating efficiency of the light-emitting module can be improved. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007201231(A) 申请公布日期 2007.08.09
申请号 JP20060018808 申请日期 2006.01.27
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TSUMURA TETSUYA;NISHIYAMA KIMIHARU;TSUJIMOTO ETSUO;NAKAO KEIICHI
分类号 H01L33/64;H01L23/12;H01L33/54;H01L33/56;H01L33/62 主分类号 H01L33/64
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