| 摘要 |
PROBLEM TO BE SOLVED: To obtain a sealing epoxy resin composition liquid at a normal temperature, which is applied to the surface of the connection part of electronic component, is easily removed by heating at a high temperature and has improved adhesivity and strength at a room temperature. SOLUTION: The epoxy resin composition comprises an epoxy resin, a curing agent or a curing promoter and 1-40 wt.% based on the total of the composition of thermoplastic polymer particles having 1-50μm average particle diameter. COPYRIGHT: (C)2007,JPO&INPIT
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