发明名称 |
ARRANGEMENT COMPRISING AT LEAST ONE ELECTRONIC COMPONENT |
摘要 |
The invention relates to an arrangement comprising at least one electronic component (1) and a cooling body (3) associated therewith and a support physically interposed between the electronic component (1) and the cooling body (3) and having at least one layer (2) with at least one material of an electric strength of at least 10 kV/mm and a thermal conductivity of at least 5 W/mK. At least one recess (5) and/or at least one protruding element is arranged in and/or on the layer (2) of the support and is configured in such a manner that it extends, along the surface of the layer (2) of the support, preferably all electrically possible pathways between the electronic component (1) and the cooling body as compared to the condition of the layer (2) of the support without the recess (5) and/or without the protruding element. |
申请公布号 |
WO2007068018(A3) |
申请公布日期 |
2007.08.09 |
申请号 |
WO2006AT00510 |
申请日期 |
2006.12.11 |
申请人 |
B2 ELECTRONIC GMBH;BALDAUF, STEFAN;BLANK, RUDOLF |
发明人 |
BALDAUF, STEFAN;BLANK, RUDOLF |
分类号 |
H05K9/00;H01L23/36;H01L23/373;H05K1/05 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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