SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING SYSTEM, PROGRAM, AND RECORDING MEDIUM

摘要

Wafer measurement and inspection equipment receives information on at least one of at least one processing result and operating status of a coater/developer that performs film forming and resist processing on a wafer and of an exposure apparatus that performs liquid immersion exposure on the wafer, and then optimizes wafer inspection conditions based on the received information (step (501) and step (517)). This enables good/no-good inspection of a wafer to be efficiently carried out, so that processing can be effectively performed on the wafer.