MIXED-SCALE ELECTRONIC INTERFACE

摘要

Embodiments of the present invention are directed to mixed-scale electronic interfaces, included in integrated circuits and electronic devices, that provide for dense electrical interconnection between microscale features of a predominantly microscale or submicroscale layer (302, 308) and nanoscale features of a predominantly nanoscale layer (307, 313) . The predominantly nanoscale layer, in one embodiment of the present invention, comprises a tessellated pattern of submicroscale or microscale pads (306, 312) densely interconnected by nanowire junctions (318) between sets of parallel, closely spaced nanowire bundles (314, 316) . The predominantly submicroscale or microscale layer indued pins (304, 310) positioned complementarily to the submicroscale or microscale pads (306, 312) in the predominantly nanoscale layer.