LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME
摘要
A light emitting diode and a fabrication method thereof are provided to implement an active matrix type light emitting diode by forming a normal top structure while using amorphous-silicon thin film transistor. A light emitting diode includes a substrate(210) and a thin film transistor part(230) formed on the substrate. A planarization film(250) is formed on the thin film transistor and has a contact hole. A contact electrode(280) is formed on the planarization film and is electrically connected to a source(235) or a drain electrode(236) of the thin film transistor part through the contact hole. A first electrode(241) is formed on the planarization film as being separated from an outer adjacent region of the contact electrode. An emission layer(243) is formed on the first electrode as covering the first electrode and being overlapped with the outer adjacent region of the contact electrode. A second electrode(244) is formed on the emission layer to be connected to a part of the contact electrode.
申请公布号
KR20070080150(A)
申请公布日期
2007.08.09
申请号
KR20060011303
申请日期
2006.02.06
申请人
LG ELECTRONICS INC.
发明人
KIM, CHANG NAM;KIM, SANG KYOON;LEE, HO NYUN;JUNG, MYUNG JONG;SUNG, MYEON CHANG;KANG, SUN KIL;KIM, DO YOUL;YANG, WON JAE;SHIN, YOUNG HOON;KIM, HONG GYU