| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device suitable for attaining miniaturization while securing assembling easiness between an insulator and a semiconductor element. <P>SOLUTION: The semiconductor device X1 is constituted by interposing the semiconductor element 10 between a pair of supports 20. The semiconductor element 10 has an optical element 11 and an electrode pad 12 as functional elements and its shape is, for example, rectangular parallelepiped or flat. For the pair of insulators 20, their shapes and dimensions are set so that the semiconductor element 10 is appropriately interposed between the sides 20a opposite to each other and their shapes are, for example, rectangular parallelepiped. <P>COPYRIGHT: (C)2007,JPO&INPIT |
