发明名称 METHOD OF MOUNTING ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of mounting electronic components, by which a part of which suction attitude to a suction head is incorrect or a component itself that is decided as being defective can be prevented from falling onto a substrate. <P>SOLUTION: The method includes a step, wherein electronic parts sucked to each of spindles of a suction head are conveyed to part confirmation positions and the quality of the electronic components is decided by a means for deciding the quality of electronic components; a step, wherein when there include any electronic components that are decided as being defective by the means, a plurality of electronic components are conveyed to a discarding position through the suction head; a step, wherein electronic components that are decided as being defective among the electronic components delivered to the discard position are discarded to a discarded component housing means by the suction head; and a step, wherein electronic components that are decided as being nondefective among the electronic components delivered to the discarding position are conveyed to the mounting position by the suction head, and they are mounted to a substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007200989(A) 申请公布日期 2007.08.09
申请号 JP20060015161 申请日期 2006.01.24
申请人 FUJI MACH MFG CO LTD 发明人 OHASHI TERUYUKI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
代理机构 代理人
主权项
地址