| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component housing package capable of improving the flatness of the recessed upper surface of an insulator and accurately and parallelly attaching a lid body to an insulating substrate, and an electronic component device. SOLUTION: The electronic component housing package comprises a rectangular insulating substrate 20 having the loader 20a of an electronic component 10 on an upper surface; a pair of long-length members 30 holding the loader 20a therebetween, and attached with an interval from each other to a part along the long side of the upper surface of the insulating substrate 20; and a conductor 40 to which the electronic component 10 is electrically connected. COPYRIGHT: (C)2007,JPO&INPIT |
