| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film that exhibits improved heat shrinkage and enhanced adhesive properties. SOLUTION: The low heat-shrinking and highly adhesive polyimide film is obtained by subjecting a polyimide film formed from p-phenylenediamine, 4,4'-diaminodiphenyl ether, pyromellitic dianhydride and 3,3',4,4'-biphenyltetracarboxylic acid dianhydride to a discharge treatment and subsequently to a heat treatment while keeping a tension of the film constant in the longitudinal direction and has a surface free energy of at least 80 mN/m as measured by the contact angle method and a heat shrinkage of at most 0.10% at 200°C for 1 hr. COPYRIGHT: (C)2007,JPO&INPIT
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