LOW-ADHESION MATERIAL, RESIN MOLDING MOLD, AND STAINPROOFING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a low-adhesion material having lower adhesion, especially adhesion to a basic substance, than Y2O3and excellent shape retention property and to provide a resin molding mold having excellent mold release and shape retention. SOLUTION: The die face 6 of a resin molding mold 1 is constituted from a low-adhesion material 3 comprising a solid solution La-Y2O3formed from Y2O3and another oxide La2O3. La2O3contains La having a larger ionic radius than Y3+and has a stronger basicity than Y2O3. The low-adhesion material 3 has a definite La2O3ratio to the total of Y2O3and La2O3. For these reasons, the number of sites per unit area in the low-adhesion material 3 becomes smaller than in Y2O3due to its smaller ionic radius, and the force of bonding to a basic substance becomes weaker than in Y2O3due to its basicity. This realizes the mold face 6 constituted from the low-adhesion material 3 having lower adhesion than Y2O3and excellent shape retention. COPYRIGHT: (C)2007,JPO&INPIT