INTEGRATED CIRCUITS WITH ANTENNAS FORMED FROM PACKAGE LEAD WIRES
摘要
Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips with antennas having one or more radiating elements and tuning elements that are formed from package lead wires that are appropriated shaped and arranged to form antenna structures for millimeter wave applications.
申请公布号
CA2637038(A1)
申请公布日期
2007.08.09
申请号
CA20062637038
申请日期
2006.12.18
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
GAUCHER, BRIAN P.;LIU, DUIXIAN;ZWICK, THOMAS M.;PFEIFFER, ULLRICH R.