WAFER LEVEL PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a wafer level package in which connection reliability of a solder joint and the like can be improved.

SOLUTION: A first polymer layer 26, which has an approximately elliptical shape, seeing from the top surface, and a cross section shape like a dome, is formed on a second conductive pattern layer 72. A multilayer structured body 27 is formed by covering the first polymer layer 26 with a second polymer layer 28. The multilayer structured body 27 protects a semiconductor chip 22 from thermal mechanical damage and external shock applying to a joint or a connecting line of the wafer level package in the case of reliability inspection or actual inspection.

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