| 摘要 |
PROBLEM TO BE SOLVED: To provide a device, as well as, a process evaluating the occurrence of failures or the possibility of the failures in integrated circuits. SOLUTION: The present invention is of process for evaluating the occurrence of failures or of the possibility of the failures in integrated circuits. The process includes formation of electrically conductive domain, such as a runner around a substrate or a dice. The electrically conductive domain is prepared at one or a plurality of different metallization layers within an integrated circuit. The electrically conductive domain is coupled to one or a plurality of bonding pads. The dice is detected by measuring the resistance, electrical conductivity, crosstalks, or other electrical characteristics on the electrically conductive region through the bonding pads. The detection can be utilized to predict whether there is failure of a runner generated within the integrated circuit or there is a possibility of failures. COPYRIGHT: (C)2007,JPO&INPIT |
