| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide having high heat resistance and low thermal expansibility/low moisture absorption/low hygroscopic expansibility. SOLUTION: The aromatic polyimide or aromatic polyamic acid is such as to have 10 mol% or more of structural units each of which can be obtained by copolymerization between a diamine including 3,8-diaminodibenzopyranone and an acid dianhydride such as pyromellitic dianhydride or 3,3',4,4'-biphenyltetracarboxylic dianhydride. This polyimide, which is usable in various fields including electrical/electronic ones, is suitable to electrical insulation material applications for wiring boards. COPYRIGHT: (C)2007,JPO&INPIT
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