| 摘要 |
<p>This invention provides a heat curable adhesive that, when an electronic component is pressure bonded onto a substrate with the aid of a heat curable adhesive such as an anisotropic electroconductive adhesive, can facilitate repair. The heat curable adhesive comprises a photoradical generating agent, which generates radicals upon exposure to an actinic radiation, contained in a heat curable insulating adhesive component. A repair method using this heat curable adhesive comprises, before separating the electronic component from the substrate, applying an actinic radiation to a cured product of the heat curable adhesive from the substrate side or the electronic component side to render the cured product soluble in or swellable with a predetermined solvent, and removing the cured product with the solvent. Alternatively, the repair method may comprise, after separating the electronic component from the substrate, applying an actinic radiation to a cured product of the heat curable adhesive to render the cured product soluble in or swellable with a predetermined solvent, and removing the cured product with the solvent.</p> |
