| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin multilayer substrate of all layer IVH structure employing conductive paste ensuring connection reliability even if the position of a via hole is shifted. SOLUTION: A multilayer substrate 6 laminating electric insulation substrates 1 electrical conduction between the front and rear sides thereof is attained by filling a via hole 2 penetrating a predetermined part with conductive paste 3. Diameter of the via hole 2 is decreased sequentially from the inner layer to the outer layer at such a part as the via hole 2 is arranged in the same axis over at least two electric insulation substrates 1. COPYRIGHT: (C)2007,JPO&INPIT |
