发明名称 LASER BEAM MACHINING APPARATUS AND LASER BEAM MACHINING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus and a laser beam machining method capable of realizing the laser beam machining with high accuracy. <P>SOLUTION: The laser beam machining apparatus comprises a measurement means 13 which receives a part of laser beams emitted from a laser beam oscillator 11 and measures the laser beam power from the received laser beams, an image pickup means 16 for picking up an image of a machined surface of a work 1 machined by the laser beams from the laser beam oscillator 11, an image processing means 17 for acquiring the machining result of at least one machined portion included in the image data obtained by the image pickup means 16, and a control means 20 which compares the result of measurement of the laser beam power to be obtained by the measurement means with the target value of the preset laser beam power, controls the laser beam power of the laser beams emitted from the laser beam oscillator 11 based on the result of comparison, determines acceptance/rejection of the machining based on the machining result obtained by the image processing means 17, and controls the change of the setting of the target value based on the result of determination. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007196274(A) 申请公布日期 2007.08.09
申请号 JP20060019537 申请日期 2006.01.27
申请人 SUMITOMO HEAVY IND LTD;LINTEC CORP 发明人 OKUDAIRA YASUYUKI;ISO KEIJI
分类号 B23K26/00;H01S3/00 主分类号 B23K26/00
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