| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip-on film, having improved bending properties manufactured by using a polyimide film, having high dimensional stability and appropriate modulus of elasticity. SOLUTION: In the chip-on film where wiring is formed on at least one side of the polyimide film so that an IC chip can be mounted, the polyimide film mainly uses paraphenylenediamine and 4,4'-diaminophenylether as diamine components, and a pyromellitic acid dianhydride component as acid dianhydride components. The wiring is formed on at least one surface of the polyimide film, via or without going through the intermediary of an adhesive. COPYRIGHT: (C)2007,JPO&INPIT |
