发明名称 POLYAMIDE LAMINATED MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a polyamide laminated molded product which holds excellent mechanical characteristics, heat resistance and chemical resistance possessed by a polyamide resin, usable in many use fields requiring high heat conductivity and excellent from an aspect of cost/properties. SOLUTION: The polyamide laminated molded body is constituted by laminating and bonding an olefinic resin composition of high heat conductivity to the surface of a molded body composed of a polyamide resin composition including a polyamide resin, an olefinic resin having the functional group reacted with the polyamide resin and an amorphous polyamide resin. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007196474(A) 申请公布日期 2007.08.09
申请号 JP20060016149 申请日期 2006.01.25
申请人 TOYOBO CO LTD 发明人 NAKAGAWA TOMOHIDE;TAMURA TSUTOMU
分类号 B32B27/32;C08K3/00;C08L77/00 主分类号 B32B27/32
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