| 摘要 |
A semiconductor device having a plurality of pads P 11 , P 12 , P 21 , P 22 , P 31 , and P 32 on the same plane of a semiconductor chip with wires W 1 , W 2 , and W 3 connected between the pads P 11 and P 12 , P 21 and P 22 , and P 31 and P 32 , respectively, so as to be electrically isolated from each other or without contacting each other. For the crossing and electrically isolated wires W 1 and W 2 respectively having pads P 11 and P 22 that are adjacently located very close, the wires are connected so that one pad P 11 is set to be a first bonding point where a rising portion 12 of one wire W 1 is bonded, and the other pad P 22 is set to be a second bonding point to which a downwardly inclined end of the other wire W 2 opposite from its cubic interchanging crossing and electrically isolated is bonded.
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