发明名称 Bare chip embedded PCB and method of the same
摘要 A PCB having an embedded bare chip and a manufacturing method thereof are disclosed. A method of manufacturing a PCB may include embedding a bare chip in a board such that electrode pads of the bare chip are exposed, and forming electrode bumps on the electrode pads. In this way, the mass production system of a bare chip embedded PCB can be made to have a simplified process and low cost.
申请公布号 US2007181988(A1) 申请公布日期 2007.08.09
申请号 US20070703814 申请日期 2007.02.08
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 HAN KYUNG-JIN;KIM HYUNG-TAE;KIM MOON-IL;LEE JAE-KUL;LEE DOO-HWAN
分类号 H01L23/02;H01L21/00 主分类号 H01L23/02
代理机构 代理人
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