发明名称 |
Bare chip embedded PCB and method of the same |
摘要 |
A PCB having an embedded bare chip and a manufacturing method thereof are disclosed. A method of manufacturing a PCB may include embedding a bare chip in a board such that electrode pads of the bare chip are exposed, and forming electrode bumps on the electrode pads. In this way, the mass production system of a bare chip embedded PCB can be made to have a simplified process and low cost.
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申请公布号 |
US2007181988(A1) |
申请公布日期 |
2007.08.09 |
申请号 |
US20070703814 |
申请日期 |
2007.02.08 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
HAN KYUNG-JIN;KIM HYUNG-TAE;KIM MOON-IL;LEE JAE-KUL;LEE DOO-HWAN |
分类号 |
H01L23/02;H01L21/00 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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