| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a support for mounting a semiconductor element capable of reducing cracks of a solder fillet. <P>SOLUTION: A support 100 for mounting a semiconductor element comprises a metal member; and insulating members 104a, 104b, and 104c, where the metal member is arranged, and comprises corners 102a, 102b, 102c, and 102d consisting of a main surface on which a semiconductor element is mounted, a rear surface on the side opposite to the main surface, and side surfaces. The support 100 comprises a notch 101b, provided by partially cutting the insulating member 104a from the side surface to the rear surface between the adjoining corners. The notch 101b is preferably a rectangular solid, having a major axis in the lengthwise direction of the side surface of the support 100. <P>COPYRIGHT: (C)2007,JPO&INPIT |
