发明名称 LIGHT EMITTING DIODE AND PACKAGE THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To improve luminance and a discharge characteristic in a package for a light emitting diode which uses alumina ceramic, and in the light emitting diode. <P>SOLUTION: The package for the light emitting diode is constituted by sticking a cover body having an opening with a reflecting surface on a base body for mounting a light emitting diode element and in the light emitting diode. The base body is formed by using alumina ceramic of 0.10 to 1.25 &mu;m in a pore size or of &ge;10% in porosity, and then, a thermal via is formed in the base body. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007201156(A) 申请公布日期 2007.08.09
申请号 JP20060017726 申请日期 2006.01.26
申请人 KYORITSU ELEX CO LTD;TOYODA GOSEI CO LTD 发明人 MITSUYAMA KAZUMA;YAMAMOTO NARIMIYA;KUDO KOJI;FUKUMOTO SHIGEO;FUKAE HIROYUKI;NISHIYAMA KENGO;NARITA TAKUMI;KAWAGUCHI HIROAKI;HAYASHI TOSHIMASA
分类号 H01L33/60;H01L33/62;H01L33/64 主分类号 H01L33/60
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