| 发明名称 |
LIGHT-EMITTING DIODE DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting diode device which can improve radiation and make the manufacturing easy simultaneously. <P>SOLUTION: The diode device comprises: a concave portion forming portion 4 constructed by forming a concave portion 5 including a floodlighting aperture 5a by a thermoplastic with a thermal conductivity of 1.0-9.0[W/mK]; a lead frame 3 formed on an inner bottom facing the floodlighting aperture of the concave portion; a light-emitting diode chip 7, which is arranged inside the concave portion, electrically connected to a conductive layer; and a resin layer 2 which is formed by a resin with a thermal conductivity of 1.0-9.0[W/mK] containing inorganic filler, and joined to the concave portion forming portion. <P>COPYRIGHT: (C)2007,JPO&INPIT |
| 申请公布号 |
JP2007201405(A) |
申请公布日期 |
2007.08.09 |
| 申请号 |
JP20060198088 |
申请日期 |
2006.07.20 |
| 申请人 |
TOSHIBA LIGHTING & TECHNOLOGY CORP |
发明人 |
SANPEI TOMOHIRO;IWAMOTO MASAMI;TAMURA NOBUHIRO;SAITO AKIKO;IZUMI MASAHIRO;KAWASHIMA KIYOKO;MATSUNAGA HIROYUKI;SHIOZAKI MITSURU;NOGI SHINJI |
| 分类号 |
H01L33/50;H01L33/56;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
H01L33/50 |
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