| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip component transfer device and a chip component transfer method having high positioning accuracy for chip-bonding, without the necessity of teaching the reference position for bonding a chip component on a sheet of a wafer table. <P>SOLUTION: A recognition processing unit 26 carries out recognition processing of a picture which is imaged by a component posture recognition camera 15 for the adsorption posture of this chip component after a transfer nozzle 8 takes it out from a tray 2. On the basis of this recognition processing result, a CPU 21 controls the transfer nozzle 8 so as to correct the angular orientation, and also a wafer table 4 so as to correct the X and Y directions. A bonded-component recognition camera 16 images the chip component in a state where it is transferred to a sheet 5 on the wafer table 4 by the transfer nozzle 8 by using this correction control. As for this picture, the amount of displacement from the position to be bonded on the basis of the recognition processing result obtained by the recognition processing unit 26 is stored in a RAM22, so that the CPU 21 may consider this amount of displacement so as to control the pitch sending of the wafer table 4 in the case of next bonding. <P>COPYRIGHT: (C)2007,JPO&INPIT |
