| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device and a cleaning device for removing residue adhering to a semiconductor substrate or a structural body formed on a semiconductor substrate, in proper conditions for each semiconductor substrate. <P>SOLUTION: A method for manufacturing a semiconductor device includes: carrying out the dry etching of a semiconductor substrate 5 or a structural body formed on the semiconductor substrate; supplying liquid to the semiconductor substrate; and measuring the resistivity or conductivity of the supplied liquid. A removing liquid is supplied for removing etching residue adhering to the semiconductor substrate or the structural body to the semiconductor substrate only in a predetermined time, based on the resistivity or conductivity of the liquid in the case of removing the etching residue. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
