| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical head device in which stress is not be generated in a subframe even if an adhesive causes cubical expansion with rise in temperature. SOLUTION: Stress is not be generated in the subframe 22 even if the adhesive 235 causes the cubical expansion with the rise in temperature, since a first link board 221 and a second link board 222 which are mounted on a first subframe link area 213 and a second subframe link area 214 of a mainframe 21 respectively from upward are formed in the subframe 22, and the first subframe link area 213 and the first link board 221, and the second subframe link area 214 and the second link board 222 are bonded and fixed by the adhesives 235 and 235 respectively. COPYRIGHT: (C)2007,JPO&INPIT
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