A lid press apparatus of a semiconductor manufacturing apparatus is provided to compensate offset of a lid before pressing the same before pressing the same by using a suction unit for sucking the lid. The lid press apparatus presses and attaches a lid(11) on an upper surface of a chip. A suction unit is provided on a press block(15) which directly presses the lid. The suction unit sucks the lid before pressing the lid to compensate offset of the lid. The suction unit is comprised of a suction line(16) connected to a vacuum pressure generating unit. The suction line of the press block is comprised of at least two lines formed at both sides facing each other on the press block. Defective proportion of the chip is dramatically reduced by sucking the lid before pressing it.
