| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain an electronic device in which warp of a substrate is suppressed when a chip is mounted by reducing a stress on the interface between an electronic device chip and a thin mounting substrate. <P>SOLUTION: A framelike member 5 having an elastic modulus of 10 GPa or above is stuck to the surface at the outer circumference of a thin multilayer substrate 1 mounting an electronic device chip 6, and elastic modulus of insulating resin composing the thin multilayer substrate 1 is set to 100 MPa or less. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
