| 摘要 |
PROBLEM TO BE SOLVED: To provide a means to enhance solder adhesive strength between an electronic device and a wiring board. SOLUTION: The solder is used to connect an electronic device and a wiring board with each other. In this case, the solder is made of Sn-Ag(3%)-Cu(0.5%), and a spacer is made of spherical metal, resin sphere or conductive resin sphere with a particle size of 10-50μm. Such the solder and the spacer having 10-30 vol.% to solder are mixed to obtain the solder paste. COPYRIGHT: (C)2007,JPO&INPIT |
