| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cooling structure of a power semiconductor element which can control the temperature of the element easily and properly while attaining a size reduction, and to provide an invertor. <P>SOLUTION: The cooling structure of the power semiconductor element is equipped with a plurality of chips 31 loaded on a loading surface, a cooling water channel 26 formed facing the loading surface, and fins 41 provided projecting from the inner wall of the cooling water channel 26 into the cooling water channel 26. The cooling water channel 26 has a straight portion 15 extending linearly and a connector 16 extending while bending. The fin 41 has a straight fin 42 and a wavy fin 43. The wavy fin 43 is arranged in a division of a portion of the straight portion 15. A chip 31 includes a chip 31D arranged facing the connector 16. The cooling structure of the power semiconductor element is furthermore equipped with a controller which controls the current flowing in the chip 31 based on the temperature information of the chip 31D. <P>COPYRIGHT: (C)2007,JPO&INPIT |
