| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free metallic material for an electronic component that has excellent oxidation resistance and is suitable as a lead-free solder and a lead-free plating material. SOLUTION: The lead-free metallic material for an electronic component is composed of an Sn-base alloy comprising, by weight, 0.005 to 2.0% Ta. The lead-free solder is composed of an Sn-based alloy comprising 0.005 to 2.0% Ta. The lead-free plating material is composed of an Sn-base alloy comprising 0.005 to 2.0% Ta. The lead-free solder further comprises additional elements selected from Zn, Bi, In, Cu and Ag, and at least one kind of additional element selected from Co, Ti, Ni, Pd, Sb and Ge as well. The lead-free plating material comprises In, and further comprises at least one of additional element selected from Ag, Cu and Zn. COPYRIGHT: (C)2007,JPO&INPIT
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