| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device capable of reducing inclusion of the outside air in a molten solder, and preventing circulation of oxide residues in a solder tank. SOLUTION: A solder oxidation control device 101 consisting of a net cage part 7 and a rectifying plate 8 to cover a part of an opening part is provided at the position at which a molten solder 1 flows down from a solder ejecting frame 3 in a jet type solder tank 3. The flowing-down molten solder 1 is received by the rectifying plate 8, and the flow of the molten solder 1 is controlled by the rectifying plate 8. The molten solder 1 is allowed to slowly flow from an end 8a of the rectifying plate 8 and a slit-shaped hole 9 onto a molten solder level in the net basket part 7 with its lower portion sunken below the level of the molten solder 1. By controlling the inclusion of the outside air when the molten solder flows down onto the level, oxidation of the molten solder 1 can be reduced, and oxide residues such as oxides and sherbet-like solder dross can be separated by passing the molten solder 1 through the holes in the net basket part 7. COPYRIGHT: (C)2007,JPO&INPIT
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