| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a built-in semiconductor-element including board suitable for its fining design. <P>SOLUTION: With respect to the built-in semiconductor-element including board 12, a semiconductor element 26 is disposed in a recess provided in an inorganic-material base 11, and each pierced hole provided in the periphery of the recess of the inorganic-material base 11 is filled with a through hole filling resin 17. Further, each through-hole 20 passed through the through hole filling resin 17 in its thickness direction and each electrode pad 27 of the semiconductor element 26 are connected by each connective wiring pattern 42. In comparison with the case wherein a pierced hole is pierced directly in the inorganic-material base 11 to form a through-hole, the diameter of the through-hole 20 can be made small, and resultantly, the semiconductor-element integrating board 12 can be miniaturized. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
