| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for semiconductor wafer capable of preventing loss of chamfers in a planarization process. SOLUTION: Sliced wafers are obtained by cutting a semiconductor ingot. A primary planarization process is performed on the sliced wafers, and irregularities are removed. A chamfering process is performed on the peripheral part of the sliced wafers whose irregularities have been removed. Then, secondary planarization is performed. After that, the front surface of the processed wafer is etched. COPYRIGHT: (C)2007,JPO&INPIT
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